W19B320AT/B
9.2
9.3
9.4
9.5
9.6
9.7
9.8
9.9
9.10
9.11
9.12
9.13
9.14
Reset Waveform ........................................................................................................... 42
#BYTE Waveform for Read Operation ......................................................................... 43
#BYTE Waveform for Write Operation ......................................................................... 43
Programming Waveform............................................................................................... 44
Accelerated Programming Waveform........................................................................... 44
Chip/Sector Erase Waveform ....................................................................................... 45
Back-to back Read/Write Cycle Waveform .................................................................. 45
#Data Polling Waveform (During Embedded Algorithms) ............................................ 46
Toggle Bit Waveform (During Embedded Algorithms) ................................................. 46
DQ 2 vs. DQ6 Waveform .............................................................................................. 47
Temporary Sector Unprotect Timing Diagram.............................................................. 47
Sector/Sector Block Protect and Unprotect Timing Diagram ....................................... 47
Alternate #CE Controlled Write (Erase/Program) Operation Timing............................ 48
10.
11.
12.
13.
LATCHUP CHARACTERISTICS .............................................................................................. 49
CAPACITANCE......................................................................................................................... 49
ORDERING INFORMATION .................................................................................................... 50
PACKAGE DIMENSIONS ......................................................................................................... 51
13.1
13.2
TFBGA48ball (6X8 mm^2, ?=0.40mm)........................................................................ 51
48-Pin Standard Thin Small Outline Package .............................................................. 52
14.
VERSION HISTORY ................................................................................................................. 53
Publication Release Date: December 27, 2005
-3-
Revision A4
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相关代理商/技术参数
W19B320B 制造商:WINBOND 制造商全称:Winbond 功能描述:32Mbit, 2.7~3.6-volt single bank CMOS flash memory
W19B320BB 制造商:WINBOND 制造商全称:Winbond 功能描述:32Mbit, 2.7~3.6-volt single bank CMOS flash memory
W19B320BB-H 制造商:WINBOND 制造商全称:Winbond 功能描述:2.7~3.6-volt write (program and erase) operations
W19B320BB-M 制造商:WINBOND 制造商全称:Winbond 功能描述:2.7~3.6-volt write (program and erase) operations
W19B320BT 制造商:WINBOND 制造商全称:Winbond 功能描述:32Mbit, 2.7~3.6-volt single bank CMOS flash memory
W19B320BT-H 制造商:WINBOND 制造商全称:Winbond 功能描述:2.7~3.6-volt write (program and erase) operations
W19B320BT-M 制造商:WINBOND 制造商全称:Winbond 功能描述:2.7~3.6-volt write (program and erase) operations
W19B320BTT7H 功能描述:IC FLASH 32MBIT 70NS 48TSOP RoHS:是 类别:集成电路 (IC) >> 存储器 系列:- 产品变化通告:Product Discontinuation 26/Apr/2010 标准包装:136 系列:- 格式 - 存储器:RAM 存储器类型:SRAM - 同步,DDR II 存储容量:18M(1M x 18) 速度:200MHz 接口:并联 电源电压:1.7 V ~ 1.9 V 工作温度:0°C ~ 70°C 封装/外壳:165-TBGA 供应商设备封装:165-CABGA(13x15) 包装:托盘 其它名称:71P71804S200BQ